Philips Stereo Amplifier BGY1916 User Manual

DISCRETE SEMICONDUCTORS  
DATA SHEET  
handbook, halfpage  
BGY1916  
UHF amplifier module  
Product specification  
2000 Oct 17  
Supersedes data of 1998 May 27  
 
Philips Semiconductors  
Product specification  
UHF amplifier module  
BGY1916  
CHARACTERISTICS  
Tmb = 25 °C; VS1 = 5 V; VS2 = 26 V; PL = 16 W; ZS = ZL = 50 unless otherwise specified.  
SYMBOL  
PARAMETER  
frequency  
CONDITIONS  
MIN.  
1930  
TYP.  
MAX.  
UNIT  
MHz  
f
1990  
28  
IS1  
supply current  
supply current  
load power  
16  
24  
30  
80  
430  
mA  
mA  
W
IS2  
PD < 60 dBm  
PD < 63 mW  
PL  
Gp  
power gain  
dB  
η
H2  
efficiency  
%
second harmonic  
third harmonic  
input VSWR  
stability  
35  
45  
1.6 : 1  
60  
dBc  
dBc  
H3  
VSWRin  
VSWR 2 : 1 through all phases;  
PL 16 W; VS2 = 25 to 27 V  
carrier = 16 W; Preverse = 40 dBc;  
fi = fc ±200 kHz  
corner frequency = 3 dB;  
carrier = 16 W; modulation = 20%  
dBc  
dBc  
MHz  
reverse intermodulation  
AM bandwidth  
P
53  
B
2
P
ruggedness  
VSWR 5 : 1 through all phases  
no degradation  
MGD187  
MGD186  
30  
60  
30  
handbook, halfpage  
handbook, halfpage  
G
p
η
(%)  
G
p
P
L
(dB)  
20  
(W)  
20  
40  
η
10  
20  
10  
0
0
0
30  
0
0
10  
20  
40  
80  
P
120  
P
(W)  
(mW)  
IN  
L
f = 1960 MHz; VS1 = 5 V; VS2 = 26 V; ZS = ZL = 50 ; Tmb = 25 °C.  
f = 1960 MHz; VS1 = 5 V; VS2 = 26 V; ZS = ZL = 50 ; Tmb = 25 °C.  
Fig.2 Power gain and efficiency as functions of  
load power; typical values.  
Fig.3 Load power as a function of input power;  
typical values.  
2000 Oct 17  
3
 
Philips Semiconductors  
Product specification  
UHF amplifier module  
BGY1916  
APPLICATION INFORMATION  
C7  
C5  
C8  
C6  
Z
Z
2
R1  
L1  
R2  
L2  
1
C3  
C1  
C4  
C2  
50 Ω  
V
V
50 Ω  
output  
S1  
S2  
input  
MGM861  
Fig.4 Test circuit.  
List of components (see Figs 4 and 5)  
COMPONENT  
DESCRIPTION  
electrolytic capacitor  
VALUE  
CATALOGUE NO.  
C1, C2  
C3, C4  
C5, C6  
C7, C8  
L1, L2  
R1, R2  
Z1, Z2  
10 µF; 35 V  
10 nF; 50 V  
100 pF; 50 V  
10 pF; 50 V  
multilayer ceramic chip capacitor  
multilayer ceramic chip capacitor  
multilayer ceramic chip capacitor  
Grade 4S2 Ferroxcube bead  
metal film resistor  
4330 030 36300  
2322 195 13109  
10 ; 0.4 W  
stripline: note 1  
50 Ω  
Note  
1. The striplines are on a double copper-clad printed-circuit board (RO5880) with εr = 2.2 and thickness = 0.79 mm.  
2000 Oct 17  
4
 
Philips Semiconductors  
Product specification  
UHF amplifier module  
BGY1916  
90  
42  
C7  
C5  
C8  
C6  
R1  
L1 L2  
R2  
C3  
C1  
C4  
C2  
Z
Z
1
2
MGM862  
output V  
V
input  
S2  
S1  
Dimensions in mm.  
Fig.5 Printed-circuit board component layout.  
5
2000 Oct 17  
 
Philips Semiconductors  
Product specification  
UHF amplifier module  
BGY1916  
MOUNTING RECOMMENDATIONS  
The module should be mounted to the heatsink using  
3 mm bolts with flat washers. The bolts should first be  
tightened to “finger tight” and then further tightened in  
alternating steps to a maximum torque of 0.4 to 0.6 Nm.  
To ensure a good thermal contact and to prevent  
mechanical stress when bolted down, the flatness of the  
mounting base is designed to be typically better than  
0.1 mm. The mounting area of the heatsink should be flat  
and free from burrs and loose particles. The heatsink  
should be rigid and not prone to bowing under thermal  
cycling conditions. The thickness of a solid heatsink  
should be not less than 5 mm to ensure a rigid assembly.  
Once the module is mounted on the heatsink, the leads  
can be soldered to the printed-circuit board. A soldering  
iron may be used up to a temperature of 250 °C for a  
maximum of 10 seconds at a distance of 2 mm from the  
plastic cap.  
A thin, even layer of thermal compound should be applied  
between the mounting base and the heatsink to achieve  
the best possible thermal contact resistance. Excessive  
use of thermal compound will result in an increase in  
thermal resistance and possible bowing of the mounting  
base; too little will also result in poor thermal conduction.  
Precautions must be taken to protect the device from  
electrostatic damage (ESD).  
2000 Oct 17  
6
 
Philips Semiconductors  
Product specification  
UHF amplifier module  
BGY1916  
PACKAGE OUTLINE  
Plastic rectangular single-ended flat package; flange mounted; 2 mounting holes; 4 in-line leads  
SOT365A  
D
A
F
y
U
q
A
U
2
p
U
1
E
L
1
2
3
4
b
p
w
M
v
c
A
e
e
e
Z
Q
1
0
10  
20 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
UNIT  
A
b
c
D
E
e
e
F
L
p
Q
q
U
U
U
v
w
y
Z
p
1
1
2
9.5 0.56  
9.0 0.46  
4.0  
3.8  
0.3 30.1 18.6  
0.2 29.9 18.4  
3.25 6.5  
3.15 6.1  
4.1  
3.9  
40.74 48.0 15.4 7.75  
40.54 48.4 15.2 7.55  
12.8  
12.6  
mm  
2.54 17.78  
0.3 0.25 0.1  
REFERENCES  
JEDEC  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
EIAJ  
SOT365A  
99-02-06  
2000 Oct 17  
7
 
Philips Semiconductors  
Product specification  
UHF amplifier module  
BGY1916  
DATA SHEET STATUS  
PRODUCT  
STATUS  
DATA SHEET STATUS  
DEFINITIONS (1)  
Objective specification  
Development This data sheet contains the design target or goal specifications for  
product development. Specification may change in any manner without  
notice.  
Preliminary specification Qualification  
This data sheet contains preliminary data, and supplementary data will be  
published at a later date. Philips Semiconductors reserves the right to  
make changes at any time without notice in order to improve design and  
supply the best possible product.  
Product specification  
Production  
This data sheet contains final specifications. Philips Semiconductors  
reserves the right to make changes at any time without notice in order to  
improve design and supply the best possible product.  
Note  
1. Please consult the most recently issued data sheet before initiating or completing a design.  
DEFINITIONS  
DISCLAIMERS  
Short-form specification  
The data in a short-form  
Life support applications  
These products are not  
specification is extracted from a full data sheet with the  
same type number and title. For detailed information see  
the relevant data sheet or data handbook.  
designed for use in life support appliances, devices, or  
systems where malfunction of these products can  
reasonably be expected to result in personal injury. Philips  
Semiconductors customers using or selling these products  
for use in such applications do so at their own risk and  
agree to fully indemnify Philips Semiconductors for any  
damages resulting from such application.  
Limiting values definition Limiting values given are in  
accordance with the Absolute Maximum Rating System  
(IEC 60134). Stress above one or more of the limiting  
values may cause permanent damage to the device.  
These are stress ratings only and operation of the device  
at these or at any other conditions above those given in the  
Characteristics sections of the specification is not implied.  
Exposure to limiting values for extended periods may  
affect device reliability.  
Right to make changes  
Philips Semiconductors  
reserves the right to make changes, without notice, in the  
products, including circuits, standard cells, and/or  
software, described or contained herein in order to  
improve design and/or performance. Philips  
Semiconductors assumes no responsibility or liability for  
the use of any of these products, conveys no licence or title  
under any patent, copyright, or mask work right to these  
products, and makes no representations or warranties that  
these products are free from patent, copyright, or mask  
work right infringement, unless otherwise specified.  
Application information  
Applications that are  
described herein for any of these products are for  
illustrative purposes only. Philips Semiconductors make  
no representation or warranty that such applications will be  
suitable for the specified use without further testing or  
modification.  
2000 Oct 17  
8
 
Philips Semiconductors  
Product specification  
UHF amplifier module  
BGY1916  
NOTES  
2000 Oct 17  
9
 
Philips Semiconductors  
Product specification  
UHF amplifier module  
BGY1916  
NOTES  
2000 Oct 17  
10  
 
Philips Semiconductors  
Product specification  
UHF amplifier module  
BGY1916  
NOTES  
2000 Oct 17  
11  
 
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70  
SCA  
© Philips Electronics N.V. 2000  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.  
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed  
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license  
under patent- or other industrial or intellectual property rights.  
Printed in The Netherlands  
613524/05/pp12  
Date of release: 2000 Oct 17  
Document order number: 9397 750 07589  
 

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